Products
High-Purity FFKM
Low-outgassing, low-extractable FFKM for contamination-sensitive processes.
High-purity FFKM compounds are formulated and processed to minimise outgassing and extractable contamination — the two mechanisms that most often limit yield in semiconductor and vacuum processes.
Selected grades target very low total mass loss (TML) and collected volatile condensable materials (CVCM) measured to ASTM E595, together with low metal-ion extractables and low particle generation.
Key characteristics
- Formulated for low outgassing and low extractables
- Targets TML ≤ 0.1 % and CVCM ≤ 0.01 % to ASTM E595 — to be replaced by the client's own test report before go-live
- Reduced metal-ion extractables (OMS7102 is the low-metal-ion grade)
- Low particle generation to support cleanroom processes
- Designed for plasma, etch, CVD and UHV sealing
Specifications
- TML / CVCM
- Per grade, ASTM E595 — client test report
- Metal-ion extractables
- Reduced — OMS7102 is the low-metal-ion grade
- Particle generation
- Low — supports cleanroom processes
- Post-cure / cleaning
- Available on request
- Ultimate vacuum
- To 1.33 × 10⁻⁷ Pa (internal test) — client data
- Service temperature
- Up to +320 °C (OME7505)
Typical applications
- Plasma etch / ashing and deposition chambers
- Gas delivery, KF fittings and manifolds
- Viewports, slit valves and load locks
- Ultra-high-vacuum (UHV) systems
Standards
ASTM E595 · ASTM D1418 · SEMI F57 (context)
Grades used in this product line
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