Applications
Semiconductor
Plasma- and chemistry-resistant FFKM seals for wafer fabrication.
What goes wrong
- Plasma, HF, NF₃ and chlorine species attack conventional elastomers
- Particle and metal contamination directly reduce device yield
- High-temperature thermal processes (diffusion, epitaxy, RTP) require stable compression set
- Long service intervals demand low outgassing and low extraction
Process steps
CVD / PECVD / HDPCVD / RPCVDPlasma etch and ashingDiffusion, RTP and epitaxySputter, implant and wet clean
Equipment
Chamber doors and slit / pendulum valvesGas inlets and KF fittingsViewports and exhaust linesPlasma generators
Grades we would start from
OMS70S
73 Shore A · -10 to +275 °C
Grade dataOMS7102
75 Shore A · -10 to +300 °C
Grade dataOME7505
75 Shore A · -10 to +320 °C
Grade dataOMS7503
70 Shore A · -10 to +275 °C
Grade dataWhere each grade fits
- OMS70S — transparent, ultra-high-purity grade for O₂ / F-based plasma
- OMS7102 — low-metal-ion white grade for etch and CVD
- OME7505 — thermal-process grade up to 320 °C
Other environments
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